Home Contact Us Site Map
  Products Customer Resources Company News & Events Careers  
   
Probing
 
spacer
Overview
History
Offices
   

For more than 40 years, semiconductor companies have turned to Electroglas for technology to meet the industry's evolving manufacturing needs. Founded in 1960 as Specialty Products, a producer of glass capillaries, the company quickly adapted its focus to meet the emerging need for wafer probing technology, adopting the name Electroglas.

Since then, a fierce commitment to research and development has established Electroglas as a leading provider of automated probing technologies, with more than 15,000 systems shipped. The company's dedication to improving customer test efficiency has also resulted in the delivery of visionary prober-based solutions for both sort floor and final test applications.

A History of Innovation

2009 - Acquired by EG Systems LLC.

2005 - Introduction of the EG6000, the fastest, most accurate and reliable prober on the market. The EG6000, Electroglas’ second generation 300mm prober, fuses the automation and reliability requirements of high-volume manufacturing environments with the highest caliber of prober technology. The EG6000e, a fully automatic 300mm parametric wafer prober is designed for high throughput, low noise measurements. The EG6000e is introduced to combine automation features, throughput and reliability of a high volume manufacturing tool with industry leading, low noise chuck technology.

2004 - The 4090+, >a new extended performance wafer prober system for 200 mm wafers, is introduced to address the demands of testing fine pitch devices, semiconductors with copper interconnects and low-k dielectric processes, and other advanced applications. Advanced Packaging names Electroglas' Sidewinder strip test handler the Best New Product for Handling Equipment. introduction of the 4090 Micro Plus, a new extended performance wafer prober system for 200 mm wafers.

2003 - Sidewinder becomes Electroglas' second prober-based final test handling solution, delivering superior throughput and accuracy for the handling of packaged semiconductor and discrete components in panel or lead frame format.

2002 - Electroglas extends its prober technology into the final test arena, delivering Pathfinder - an advanced, fully automatic wafer, die and package test-handling system. The new system allows chipmakers to accurately test known-good die, wafer-level packages, and microelectromechanical systems (MEMS) after dicing.

2001 - Electroglas launches the EG5|300 ARGOS, the first 300mm wafer prober capable of 1.0micron stepping accuracy. At the same time, the Horizon 4090µ Fast Probe is introduced, delivering up to 40% faster stepping times to increase overall system throughput for small die applications.

2000 - The Horizon 4090f is introduced, offering an automatic film-frame probing system for the testing of die and ultra-thin wafers. The EG5|300e, a high-throughput, automatic prober for parametric testing on 300mm wafers is also introduced.

1999 - The EG4|200 becomes the only prober capable of exerting the extremely high probe loads required for multiple die and bumped wafer testing. The EG5|300 launches Electroglas into the 300mm market with a new system architecture and advanced automation features for improved accuracy, throughput and reliability.

1996-1998 - Electroglas delivers the Horizon 4090, providing faster speeds, improved accuracy and broad compatibility with third-party equipment. The Horizon 4090µ, introduced in 1997, offers a comprehensive probing solution for ultra-clean parametric test environments.

1986-1992 - The 3001 becomes the world's first prober designed to handle 8-inch wafers, and the Horizon 4060 and 4080 are the first to use new, highly advanced Electroglas system software - EGCommander.

1982-1985 - Electroglas introduces the industry's first fully automated prober, the 2001. This product quickly became an industry standard. Electroglas also released the 2010 during this time, utilizing a robotic material handler for safe, efficient wafer processing.

1973 - The Electroglas 1034x becomes the first prober to employ a sawyer motor, enabling frictionless, high-speed wafer positioning.

1964 - Electroglas introduces the first commercial prober for testing semiconductor die (the EG 900), seven years before the introduction of the first microprocessor.