For more than 40 years, semiconductor companies have turned to Electroglas for technology to meet the industry's evolving manufacturing needs. Founded in 1960 as Specialty Products, a producer of glass capillaries, the company quickly adapted its focus to meet the emerging need for wafer probing technology, adopting the name Electroglas.
Since then, a fierce commitment to research and development has established
Electroglas as a leading provider of automated
probing technologies, with more than
15,000 systems shipped. The company's dedication
to improving customer test efficiency has also
resulted in the delivery of visionary prober-based
solutions for both sort floor and final test applications.
A History of Innovation
2009 - Acquired by EG Systems LLC.
2005 - Introduction of the EG6000, the fastest, most
accurate and reliable prober on the market. The EG6000,
Electroglas’ second generation 300mm prober,
fuses the automation and reliability requirements
of high-volume manufacturing environments with the
highest caliber of prober technology. The EG6000e,
a fully automatic 300mm parametric wafer prober is
designed for high throughput, low noise measurements.
The EG6000e is introduced to combine automation features,
throughput and reliability of a high volume manufacturing
tool with industry leading, low noise chuck technology.
2004 - The 4090µ+,
new extended performance wafer prober system for
200 mm wafers, is introduced to address the
demands of testing fine pitch devices,
semiconductors with copper interconnects and low-k
dielectric processes, and other advanced
applications. Advanced Packaging names Electroglas'
Sidewinder strip test handler the Best New Product
for Handling Equipment. introduction of the 4090 Micro Plus, a new extended
performance wafer prober system for 200 mm wafers.
2003 - Sidewinder
becomes Electroglas' second prober-based final test
handling solution, delivering superior throughput
and accuracy for the handling of packaged
semiconductor and discrete components in panel or
lead frame format.
2002 - Electroglas extends its prober technology into the final test arena, delivering Pathfinder - an advanced, fully automatic wafer, die and package test-handling system. The new system allows chipmakers to accurately test known-good die, wafer-level packages, and microelectromechanical systems (MEMS) after dicing.
2001 - Electroglas launches the EG5|300 ARGOS, the first 300mm wafer prober capable of ± 1.0micron stepping accuracy. At the same time, the Horizon 4090µ Fast Probe is introduced, delivering up to 40% faster stepping times to increase overall system throughput for small die applications.
2000 - The Horizon 4090f is introduced, offering an automatic film-frame probing system for the testing of die and ultra-thin wafers. The EG5|300e, a high-throughput, automatic prober for parametric testing on 300mm wafers is also introduced.
1999 - The EG4|200 becomes the only prober capable of exerting the extremely high probe loads required for multiple die and bumped wafer testing. The EG5|300 launches Electroglas into the 300mm market with a new system architecture and advanced automation features for improved accuracy, throughput and reliability.
1996-1998 - Electroglas delivers the Horizon 4090, providing faster speeds, improved accuracy and broad compatibility with third-party equipment. The Horizon 4090µ, introduced in 1997, offers a comprehensive probing solution for ultra-clean parametric test environments.
1986-1992 - The 3001 becomes the world's first prober designed to handle 8-inch wafers, and the Horizon 4060 and 4080 are the first to use new, highly advanced Electroglas system software - EGCommander.
1982-1985 - Electroglas introduces the industry's first fully automated prober, the 2001. This product quickly became an industry standard. Electroglas also released the 2010 during this time, utilizing a robotic material handler for safe, efficient wafer processing.
1973 - The Electroglas 1034x becomes the first prober to employ a sawyer motor, enabling frictionless, high-speed wafer positioning.
1964 - Electroglas introduces the first commercial prober for testing semiconductor die (the EG 900), seven years before the introduction of the first microprocessor.