Electroglas Introduces a Turn-Key Motion System to Lower Costs and Accelerate VAR Development
	e2v Selects Electroglas EG6000 300mm Wafer Prober
	Freescale Selects Electroglas EG6000e 300mm Wafer Prober
	Electroglas Announces Warren Kocmond as Chief Operating Officer
	Electroglas Receives Patent for Advanced Dual Loop Z-Stage Control
	Electroglas Awarded Patent for Microtouch Probe Card Impact Control Algorithm
	Broadcom Selects Electroglas EG6000 300mm Wafer Prober
	Electroglas Awarded Patent for Active Vibration Control

Investor and Corporate Communications Contact: Electroglas, Inc. Candi Lattyak 408.528.3801