Electroglas test handlers are built upon proven prober technology to provide the lowest cost of test for nearly all packaging types, including wafer level packages (WLP), known-good die (KGD), microelectromechanical systems (MEMS), ultra-thin and/or diced wafers, as well as any packages in strip, panel or lead frame format.
Electroglas Automated Test Handlers Key Benefits:
Greater handling speed and accuracy from what's possible with traditional
Simplified final test process
Maximized profitability by increasing test