To ensure device quality, chipmakers need the ability to accurately test known-good die, wafer-level packages and microelectromechanical systems (MEMS) after dicing. Pathfinder is an advanced, fully automatic wafer, die and package test-handling system that enables chipmakers to maximize efficiency, yield and profit.
Pathfinder Key Benefits:
- Leverages Electroglas' production-proven prober technology to bring
a new level of automation to the die and package test arena.
non-linear alignment techniques that deliver unparalleled accuracy,
even for multi-die testing applications.
- Safe testing
of ultra-thin wafers and other fragile substrates without risk
of breakage or micro-cracking.
- The ability to test multiple,
singulated and non-singulated package strips, saving valuable
test time during ball grid array (BGA), micro ball grid array
(MBGA) and chip scale packages (CSP) production.
testing of package device strips or panels mounted on film
in industry-standard film frames.