Leading-edge 300mm wafer production demands wafer probing that can address shrinking geometries and deliver extremely accurate, high-throughput for fine-pitch probing applications and advanced devices with copper interconnects and low-k dielectrics that require special handling. Designed with our customers' production challenges in mind, Electroglas' 300mm wafer probers provide reliable, accurate, high-throughput production capability for real-world test environments.
Which system is right for you?
EG6000 World's fastest, most accurate, most reliable 300mm production prober.
EG6000e Fine-pitch probing for parametric test structures, wafer-level reliability (WLR) and wafer acceptance test (WAT).