Fast probing for high throughput of small die
For many chipmakers engaged in 200mm wafer production, throughput is the
single most important factor with regard to wafer probing. The Horizon
4090µ+ Fast Probe is designed to meet the need for speed, delivering
the shortest 200 mm wafer probing stepping times available.
4090µ+ Fast Probe Key Benefits:
- Increased manufacturing throughput and productivity.
- Reduced cost-of-ownership
for applications that require short test times or testing of
large numbers of die per wafer.
- 40-50 percent
gain in system throughput and manufacturing for low-cost, commodity-type